深圳市道丰宁科技有限公司

Two-component, thermosetting, rapidly cures upon heating, medium strength, high elongation at break, suitable for rapid heating bonding and sealing on various substrates.

Single-component, condensation type, with UL94-V0 flame retardant grade, suitable for bonding and fixing of PCBA components.

Single-component, room temperature curing, rapidly solidifies upon heating, has high adhesion to various metals and plastics (PPS/PBT + 30GF) and other substrates. It is suitable for elastic bonding and sealing of various substrates and can replace traditional sealing rings.

Two-component, condensation type, rapid curing at room temperature, resistant to aging and with excellent electrical insulation properties. Suitable for rapid curing of shallow encapsulation in electronics and components.

Two-component, with high thixotropy and anti-sagging properties, capable of withstanding electroplating and powder coating curing processes (220°C for 60 minutes). Suitable for applications in automobiles and new energy battery boxes that require resistance to electroplating and powder spraying.

High thermal conductivity, low thermal resistance, high thixotropy, high extrusion rate, non-curing type, suitable for gap filling between various power heat-generating devices and heat dissipation interfaces