深圳市道丰宁科技有限公司

High thermal conductivity, high extrusion rate, low volatility, suitable for filling gaps between various heating power devices and heat dissipation interfaces

High thermal conductivity, low thermal resistance, high thixotropy, high extrusion rate, non curing type, suitable for filling gaps between various heating power devices and heat dissipation interfaces

Single-component, low oil content, excellent thermal performance, resistance to high and low temperatures, and resistance to climate aging, etc.

High thermal conductivity, low thermal resistance, high thixotropy, high extrusion rate, non-curing type, suitable for filling the gap between various power heating devices and heat dissipation interfaces.

High thermal conductivity, low thermal resistance, high thixotropy, high extrusion rate, non-curing type, suitable for filling the gap between various power heating devices and heat dissipation interfaces.

High thermal conductivity, low thermal resistance, high thixotropy, high extrusion rate, non-curing type, suitable for gap filling between various power heat-generating devices and heat dissipation interfaces