深圳市道丰宁科技有限公司

High thermal conductivity, low thermal resistance, high thixotropy, high extrusion rate, non-curing type, suitable for filling the gap between various power heating devices and heat dissipation interfaces.

High thermal conductivity, low thermal resistance, high thixotropy, high extrusion rate, non-curing type, suitable for filling the gap between various power heating devices and heat dissipation interfaces.

Single-component, condensation type, suitable for general-purpose bonding and sealing in fields such as automotive electronics and electronic appliances.

Single-component, condensation type, with UL94-V0 flame retardant grade, suitable for bonding and fixing of PCBA components.

Single-component, room temperature curing, rapidly solidifies upon heating, has high adhesion to various metals and plastics (PPS/PBT + 30GF) and other substrates. It is suitable for elastic bonding and sealing of various substrates and can replace traditional sealing rings.

Two-component, condensation type, rapid curing at room temperature, resistant to aging and with excellent electrical insulation properties. Suitable for rapid curing of shallow encapsulation in electronics and components.